Contact angle measurements on polysilicon for surface micromachining applications

被引：0

作者：

Bhattacharya, E ^{[1
]}

Babu, UV ^{[1
]}

Rani, LHA ^{[1
]}

Pradeep, P ^{[1
]}

Rao, PRS ^{[1
]}

Bhat, KN ^{[1
]}

机构：

[1] Indian Inst Technol, Dept Elect Engn, Madras 600036, Tamil Nadu, India

来源：

SMART MATERIALS, STRUCTURES, AND SYSTEM, PTS 1 AND 2 | 2003年 / 5062卷

关键词：

polysilicon; stiction; contact angle; surface micromachining;

D O I：

10.1117/12.514520

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Polysilicon layers deposited by Low Pressure Chemical Vapour Deposition (LPCVD) on sacrificial oxides are used for surface micromachined structures. Stiction is a major problem in surface micromachining both during processing and in use. Contact angle measurements on surfaces can give indication on the adhesivity of the surface. In this paper, contact angle measurements on polysilicon surface after different treatments are reported with a view to understand their stiction behaviour. We also report on surface roughness measurements on these samples.

引用

页码：367 / 372

页数：6

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