Dimensional stability improvement of kenaf panels by post-manufacturing hygrothermal treatments using response surface methodology

被引:11
作者
Ali, Imtiaz [1 ]
Jayaraman, Krishnan [1 ]
Bhattacharyya, Debes [1 ]
机构
[1] Univ Auckland, Ctr Adv Composite Mat, Dept Mech Engn, Auckland 1142, New Zealand
关键词
Hygrothermal treatment; Response surface; Kenaf panels; Residual stresses; Mechanical properties; Dimensional properties; MECHANICAL-PROPERTIES; DESIRABILITY FUNCTION; AQUEOUS-SOLUTION; OPTIMIZATION; TEMPERATURE; PARTICLEBOARD; PRETREATMENT; COMPOSITES; BEHAVIOR; FIBERS;
D O I
10.1016/j.indcrop.2015.01.071
中图分类号
S2 [农业工程];
学科分类号
0828 ;
摘要
The potential of various hygrothermal post manufacturing treatments is evaluated in this study to determine the suitable heat treatment and moisture conditions for relieving the internal residual stresses and improving the dimensional stability characteristics of medium density and high density kenaf fiber-boards (MDF and HDF, respectively), generally known to have poor dimensional stability. Furthermore, the effects of these conditions on the density and mechanical properties of the panels have been evaluated. The treatment involves conditioning at normal (65% relative humidity, RH) or high humidity (85% RI-I) and then heat treating these panels at different combinations of temperature and time. The results are statistically analyzed by using response surface method of Design Expert software. The desirability function is employed to find the treatment conditions that give suitable dimensional stability with minimum compromise on the mechanical properties of the panels. Within the range of experimental conditions, the parameters with maximum desirability are 225 degrees C, 30 min, 85% RH and 200 degrees C, 90 min, 85% RH for MDF and HDF panels, respectively. The panels treated under these conditions result in approximately 25-30% reduction in thickness swelling without any significant reduction in their mechanical properties with respect to those of the non- treated panels. However, with more intensive treatment, the thickness swelling within the limits of experimental study can be decreased by approximately 35%. Although some mechanical properties of the panels are compromised under these conditions, they are still above the requirements of ANSI A208.2-2009 and ANSI A135.4-2012 standards. (C) 2015 Elsevier B.V. All rights reserved.
引用
收藏
页码:422 / 431
页数:10
相关论文
共 40 条
[1]   Implications of fiber characteristics and mat densification on permeability, compaction and properties of kenaf fiber panels [J].
Ali, Imtiaz ;
Jayaraman, Krishnan ;
Bhattacharyya, Debes .
INDUSTRIAL CROPS AND PRODUCTS, 2014, 61 :293-302
[2]   Effects of resin and moisture content on the properties of medium density fibreboards made from kenaf bast fibres [J].
Ali, Imtiaz ;
Jayaraman, Krishnan ;
Bhattacharyya, Debes .
INDUSTRIAL CROPS AND PRODUCTS, 2014, 52 :191-198
[3]   Application of response surface methodology for optimization of lead biosorption in an aqueous solution by Aspergillus niger [J].
Amini, Malihe ;
Younesi, Habibollah ;
Bahramifar, Nader ;
Lorestani, Ali Akbar Zinatizadeh ;
Ghorbani, Farshid ;
Daneshi, Ali ;
Sharifzadeh, Mazyar .
JOURNAL OF HAZARDOUS MATERIALS, 2008, 154 (1-3) :694-702
[4]  
Anderson MarkJ., 2005, RSM SIMPLIFIED OPTIM
[5]  
ANSI, 2012, A13542012 ANSI COMP
[6]  
ANSI, 2009, A20822009 ANSI COMP
[7]   Effect of thermal-treatment of wood fibres on properties of flat-pressed wood plastic composites [J].
Ayrilmis, Nadir ;
Jarusombuti, Songklod ;
Fueangvivat, Vallayuth ;
Bauchongkol, Piyawade .
POLYMER DEGRADATION AND STABILITY, 2011, 96 (05) :818-822
[8]   Dimensional stability and creep behavior of heat-treated exterior medium density fiberboard [J].
Ayrilmis, Nadir ;
Laufenberg, Theodore L. ;
Winandy, Jerrold E. .
EUROPEAN JOURNAL OF WOOD AND WOOD PRODUCTS, 2009, 67 (03) :287-295
[9]   Properties of thermally modified medium-density fibreboards [J].
Bonigut, Juergen ;
Krug, Detlef ;
Stephani, Beate .
HOLZFORSCHUNG, 2012, 66 (01) :79-83
[10]  
Boonstra MJ, 2006, HOLZ ROH WERKST, V64, P157, DOI 10.1007/s00107-005-0055-y