Metal electroplating onto cylindrical highly porous electrodes

被引：0

作者：

Koshcheev, OP ^{[1
]}

Kichigin, VI

Kamelin, VV

Antsiferov, VN

Khafizova, RM

机构：

[1] Republican Technol Engn Ctr Powder Met, Res Inst Powder Technol & Coatings, Perm, Russia

[2] Perm State Univ, Inst Nat Sci, Perm, Russia

来源：

RUSSIAN JOURNAL OF APPLIED CHEMISTRY | 1998年 / 71卷 / 07期

关键词：

D O I：

暂无

中图分类号：

O69 [应用化学];

学科分类号：

081704 ;

摘要：

The distribution of copper and nickel in cylindrical highly porous electrodes in electroplating from sulfate (Cu) or chloride (Ni) electrolyte was studied experimentally and theoretically. Electroplating of metals onto electrodes in the form of solid or hollow circular cylinders with cylindrical coaxial or planar anodes is considered.

引用

页码：1169 / 1175

页数：7

共 15 条

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