Strain controlled growth of crack-free GaN with low defect density on silicon (111) substrate

被引:16
作者
Drechsel, P. [1 ]
Riechert, H. [1 ]
机构
[1] Paul Drude Inst Solid State Elect, D-10117 Berlin, Germany
关键词
Doping; X-ray diffraction; Metal-organic vapor phase epitaxy; Nitrides; ALGAN/ALN INTERMEDIATE LAYER; TEMPERATURE ALN INTERLAYERS; VAPOR-PHASE EPITAXY; SI SUBSTRATE; STRESS; SI(111); REDUCTION; THICKNESS;
D O I
10.1016/j.jcrysgro.2010.09.024
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
We demonstrate the growth of 4.5 mu m thick gallium nitride on 100 mm diameter silicon (1 1 1) substrate using metal-organic chemical vapor deposition. For strain engineering an aluminum nitride buffer and several interlayers were applied. The realized gallium nitride layer-stack is crack-free. Several characterization methods were applied to study the crystalline quality. In X-ray diffraction measurements the full width at half maximum of the (0 0 2) reflection was found to be as low as 400 '', whereas the (2 0 1) reflection showed a full width at half maximum of 580 ''. For verification transmission electron microscopy examinations were performed to determine the structural quality. A comparison to gallium nitride, grown on sapphire, is made. (C) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码:211 / 215
页数:5
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