Unusual example of induced codeposition of tungsten. Galvanic formation of Cu-W alloy

被引：18

作者：

Bacal, Pawel ^{[1
]}

Indyka, Paulina ^{[2
]}

Stojek, Zbigniew ^{[1
]}

Donten, Mikolaj ^{[1
]}

机构：

[1] Univ Warsaw, Fac Chem, PL-02093 Warsaw, Poland

[2] Jagiellonian Univ, Fac Chem, PL-30060 Krakow, Poland

来源：

ELECTROCHEMISTRY COMMUNICATIONS | 2015年 / 54卷

关键词：

Copper-tungsten alloy; Induced codeposition; Electrodeposition; NI-W; COBALT-TUNGSTEN; ELECTRODEPOSITION; BATH;

D O I：

10.1016/j.elecom.2015.02.016

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The codeposition of tungsten with copper was studied. Thin, compact and hard micrometer-thick layers of a new, advanced Cu-W alloy with W content of above 10 at.% (26 wt.%) have been obtained by electrodeposition. The alloy was deposited on silver substrate from citrate plating baths under conditions of constant current and high tungstate-copper ion concentration ratio. Scanning electron microscopy (SEM), energy-dispersive spectroscopy (EDS), transmission electron microscopy (TEM) and X-ray diffraction (XRD) were used to characterize the alloys. The obtained results provide evidence for the first successful codeposition of significant amount of tungsten with a metal other than the one belonging to the triad iron group. (C) 2015 Elsevier B.V. All rights reserved.

引用

页码：28 / 31

页数：4

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