Heat Treatment Effect on the Microstructure and Properties of a High-Strength and High-Conductivity Cu Nb Cu Microcomposite

被引：6
作者：
Wang, Pengfei [1 ,2 ]
Zhang, Pingxiang [1 ,2 ]
Liang, Ming [2 ]
Li, Chengshan [2 ]
Li, Jinshan [1 ]
机构：
[1] Northwestern Polytech Univ, Coll Mat, Xian 710072, Shaanxi, Peoples R China
[2] Northwest Inst Nonferrous Met Res, Xian 710016, Shaanxi, Peoples R China
来源：
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 2019年 / 29卷 / 04期
基金：
国家重点研发计划;
关键词：
Accumulative drawing and bundling (ADB) process; Cu-Nb-Cu microcomposites; mechanical properties; microstructure; MAGNETIC-PROPERTIES; THERMAL-STABILITY; TEXTURE EVOLUTION;
D O I：
10.1109/IASC.2018.2867785
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Cu-Nb-Cu microcomposite reinforced by Nb tube was successfully fabricated by accumulative drawing and bundling process. When the strength of the Cu-Nb-Cu composite reaches above 1 GPa, the conductivity can reach 67% International Annealed Copper Standard (IACS). The annealing effects on the microstructure and properties of the Cu-Nb-Cu microcomposite have been thoroughly discussed. Annealing temperature at 750 degrees C can lead to an obvious change of microstructures. Both the partial spheroidization and further coarsening of niobium filaments in Cu-Nb-Cu microcomposite have been revealed. The influences of the microstructure changes on the mechanical and electrical properties have also been analyzed.
引用
收藏
页数：5
相关论文
共 22 条
[1]   Recrystallization of niobium single crystals deformed by ECAE [J].
Bernardi, Heide H. ;
Sandim, Hugo R. Z. ;
Verlinden, Bert ;
Raabe, D. .
RECRYSTALLIZATION AND GRAIN GROWTH III, PTS 1 AND 2, 2007, 558-559 :125-+
[2]   Mechanical and electrical properties of mechanically alloyed nanocrystalline Cu-Nb alloys [J].
Botcharova, E. ;
Freudenberger, J. ;
Schultz, L. .
ACTA MATERIALIA, 2006, 54 (12) :3333-3341
[3]   Bulk texture evolution of Cu-Nb nanolamellar composites during accumulative roll bonding [J].
Carpenter, J. S. ;
Vogel, S. C. ;
LeDonne, J. E. ;
Hammon, D. L. ;
Beyerlein, I. J. ;
Mara, N. A. .
ACTA MATERIALIA, 2012, 60 (04) :1576-1586
[4]   Thermal stability of Cu-Nb microcomposite wires [J].
Deng, Liping ;
Han, Ke ;
Wang, Bingshu ;
Yang, Xiaofang ;
Liu, Qing .
ACTA MATERIALIA, 2015, 101 :181-188
[5]  
Deng LP, 2015, RARE METAL MAT ENG, V44, P1696
[6]   Microstructure and texture evolution of Cu-Nb composite wires [J].
Deng, Liping ;
Yang, Xiaofang ;
Han, Ke ;
Lu, Yafeng ;
Liang, Ming ;
Liu, Qing .
MATERIALS CHARACTERIZATION, 2013, 81 :124-133
[7]   Cu/Nb Nanocomposite Wires Processed by Severe Plastic Deformation for Applications in High Pulsed Magnets: Effects of the Multi-Scale Microstructure on the Mechanical Properties [J].
Dubois, J. B. ;
Thilly, L. ;
Lecouturier, F. ;
Olier, P. ;
Renault, P. O. .
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2012, 22 (03)
[8]   Thermal stability of nanocomposite metals: In situ observation of anomalous residual stress relaxation during annealing under synchrotron radiation [J].
Dubois, J. B. ;
Thilly, L. ;
Renault, P. O. ;
Lecouturier, F. ;
Di Michiel, M. .
ACTA MATERIALIA, 2010, 58 (19) :6504-6512
[9]   Bending Behavior of High-Strength Conductor [J].
Han, Ke ;
Goddard, Robert ;
Niu, Rongmei ;
Li, Tianlei ;
Nguyen, Doan N. ;
Michel, James R. ;
Lu, Jun ;
Pantsyrny, Victor .
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2016, 26 (04)
[10]   Length scale effects on recrystallization and texture evolution in Cu layers of a roll-bonded Cu-Nb composite [J].
Lim, S. C. V. ;
Rollett, A. D. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2009, 520 (1-2) :189-196
123