Effectiveness of electromagnetic interference shielding of carbon nanofiber/poly(vinylidene fluoride) composites as a function of heat treatment temperature and time
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作者:
Kim, MS
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Myoungji Univ, Div Ceram & Chem Engn, Yongin 449728, South KoreaMyoungji Univ, Div Ceram & Chem Engn, Yongin 449728, South Korea
Kim, MS
[1
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Lee, BO
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机构:Myoungji Univ, Div Ceram & Chem Engn, Yongin 449728, South Korea
Lee, BO
Woo, WJ
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机构:Myoungji Univ, Div Ceram & Chem Engn, Yongin 449728, South Korea
Woo, WJ
An, KH
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机构:Myoungji Univ, Div Ceram & Chem Engn, Yongin 449728, South Korea
An, KH
机构:
[1] Myoungji Univ, Div Ceram & Chem Engn, Yongin 449728, South Korea
[2] Agcy Technol & Stand, Kwacheon 427716, South Korea
The electromagnetic interference(EMI) shielding effectiveness (SE) of poly(vinylidene fluoride) (PVDF) composites was investigated using carbon nanofiber fillers prepared by catalytic chemical vapor deposition of various carbon-containing gases over Ni and Ni-Cu catalysts. The electrical conductivity of carbon nanofiber which was regarded as the key property of filler for the application of EMI shielding ranged from 4.2 to 22.4 S/cm at a pressure of 10000 psi. The electrical conductivity of carbon nanofiber/PVDF composites ranged from 0.22 to 2.46 S/cm and the EMI SE of those was in the range of 2 similar to 13 dB. The electrical conductivity of carbon nanofibers increased with the increase in heat treatment temperature and time, while the electrical conductivity of the composites increased rapidly at the initial heat treatment and then approached a certain value with the further increase of heat treatment. The SE of the composites showed a maximum at the medium heat treatment and was proportional to the electrical conductivity of the composites. It was concluded that the specific surface area of carbon nanofibers decreased with the continual heat treatment and the specific surface area of filler was an important factor for the SE of the composites.
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DEVCOM Army Res Lab, Army Res Directorate, Aberdeen Proving Ground, MD 20783 USADEVCOM Army Res Lab, Army Res Directorate, Aberdeen Proving Ground, MD 20783 USA
Langrock, Alex
Kareem, Haval
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DEVCOM Army Res Lab, Army Res Directorate, Aberdeen Proving Ground, MD 20783 USADEVCOM Army Res Lab, Army Res Directorate, Aberdeen Proving Ground, MD 20783 USA
Kareem, Haval
Auletta, Jeffrey T.
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DEVCOM Army Res Lab, Army Res Directorate, Aberdeen Proving Ground, MD 20783 USADEVCOM Army Res Lab, Army Res Directorate, Aberdeen Proving Ground, MD 20783 USA
机构:
Beijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R China
Beijing Technol & Business Univ, Beijing Key Lab Qual Evaluat Technol Hyg & Safety, Beijing 100048, Peoples R ChinaBeijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R China
Dun, Dongxing
Luo, Jingyun
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Beijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R China
Beijing Technol & Business Univ, Beijing Key Lab Qual Evaluat Technol Hyg & Safety, Beijing 100048, Peoples R ChinaBeijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R China
Luo, Jingyun
Wang, Minghao
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Beijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R China
Beijing Technol & Business Univ, Beijing Key Lab Qual Evaluat Technol Hyg & Safety, Beijing 100048, Peoples R ChinaBeijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R China
Wang, Minghao
Wang, Xingran
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Beijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R ChinaBeijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R China
Wang, Xingran
Zhou, Hongfu
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Beijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R China
Beijing Technol & Business Univ, Beijing Key Lab Qual Evaluat Technol Hyg & Safety, Beijing 100048, Peoples R ChinaBeijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R China
Zhou, Hongfu
Wang, Xiangdong
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Beijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R ChinaBeijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R China
Wang, Xiangdong
Wen, Bianying
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Beijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R ChinaBeijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R China
Wen, Bianying
Zhang, Yuxia
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Beijing Technol & Business Univ, Beijing Key Lab Qual Evaluat Technol Hyg & Safety, Beijing 100048, Peoples R ChinaBeijing Technol & Business Univ, Coll Chem & Mat Engn, Beijing 100048, Peoples R China