Intentionally patterned and spatially non-uniform film profiles in chemical vapor deposition processes

被引:2
作者
Adomaitis, Raymond A. [1 ]
机构
[1] Univ Maryland, Dept Chem & Biomol Engn, College Pk, MD 20742 USA
[2] Univ Maryland, Syst Res Inst, College Pk, MD 20742 USA
基金
美国国家科学基金会;
关键词
combinatorial chemical vapor deposition; planetary reactor system; thin film processing; chemical vapor deposition; advanced process control; weighted residual methods;
D O I
10.1016/j.surfcoat.2007.04.117
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Situations where it is desirable to control a chemical vapor deposition reactor to a spatially non-uniform film profile are presented in the context of a planetary reactor system for SiC CVD and a highly controllable reactor system designed for single-wafer combinatorial CVD processing. We focus on reactor designs and operation methods that enable deposition of spatially graded films for combinatorial studies, and on identifying and driving planetary CVD systems to a specific spatially non-uniform deposition rate profile. Known as a "Nearest Uniformity Producing Profile" (NUPP), these target profiles lead to a natural criterion for film uniformity control under wafer rotation. (c) 2007 Published by Elsevier B.V.
引用
收藏
页码:9025 / 9029
页数:5
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