Compact Modeling of Temperature Effects in FDSOI and FinFET Devices Down to Cryogenic Temperatures

被引:61
作者
Pahwa, Girish [1 ]
Kushwaha, Pragya [2 ]
Dasgupta, Avirup [3 ]
Salahuddin, Sayeef [1 ]
Hu, Chenming [1 ]
机构
[1] Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
[2] Indian Space Res Org, Space Applicat Ctr, Microelect Grp, Ahmadabad 380015, Gujarat, India
[3] IIT Roorkee, Dept Elect & Commun Engn, Roorkee 247667, Uttar Pradesh, India
关键词
Cryogenic; mobility; subthreshold swing (SS); threshold voltage; velocity saturation; BULK CMOS TECHNOLOGY; MOBILITY MODEL; ELECTRONICS; CIRCUITS; DESIGN;
D O I
10.1109/TED.2021.3097971
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present compact models that capture published cryogenic temperature effects on silicon carrier mobility and velocity saturation, as well as fully depleted silicon on insulator (FDSOI) and fin field effect transistor (Fin-FET) devices characteristics within the industry-standard Berkeley short-channel IGFET model (BSIM) framework for cryogenic IC applications such as quantum computing. For the core model charge density/surface potential calculation, we introduce an effective temperature formulation to capture the effects of the band tail states. We also present a compact model that corrects the low-temperature threshold voltage for the band-tail states, Fermi-Dirac statistics, and interface traps. New temperature-dependent mobility and velocity saturation models are accurate down to cryogenic temperature. In addition, we propose that experimentally observed ID dependence of subthreshold swing (SS) at cryogenic temperatures is a consequence of the expectedly higher rate of Coulomb scattering of free carriers.
引用
收藏
页码:4223 / 4230
页数:8
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