Challenges from interconnects in the deep sub-micron VLSI domain are now a days addressed through the new innovations. These are the materials based on graphene. Carbon Nanotubes and Graphene Nanoribbons are the two capable candidates to replace the traditional Cu in VLSI interconnect. In this paper we have reviewed the studies done till date on GNRs and their performance as interconnect in terms of delay, power dissipation and crosstalk.