Evaluation and Reduction of Signal Integrity Issues in Multiwalled Carbon Nanotube On-Chip VLSI Interconnects

Due to advancements in device scaling in very-large-scale integration (VLSI) technology, signal integrity (SI) issues play a major role to determining the performance of on-chip interconnects in high-speed digital circuits. The main SI issues are delays, peak voltage noise effects, crosstalk, and timing uncertainties. Here, the SI issues of the coupled multi-walled carbon nanotube (MWCNT) on-chip interconnects are evaluated with and without the effect of shielding technique and compared to the copper interconnects. The MWCNT exhibits an average of 47.9% smaller propagation delays than Cu in dynamic crosstalk conditions. Further, for crosstalk reduction, the active shielding (AS) and passive shielding (PS) techniques are proposed. With the AS and PS techniques, the MWCNT interconnects experience a decreased delay by 46.8% and 30.15% compared to without shielding technique, respectively. Moreover, the AS exhibits smaller crosstalk effects than the PS technique due to its input switching activities on shielded lines. In addition, the quality of the signal (QoS) and Intersymbol interference (ISI) noise effects of coupled MWCNT interconnect with and without shielding is evaluated. Finally, to improve the QoS and reduce the ISI effects, the decision feedback equalizer with the least mean square adaptive algorithm is implemented at the receiver end.