Novel prevention method of stiction using silicon anodization for SOI structure

被引:12
作者
Matsumoto, Y [1 ]
Shimada, T [1 ]
Ishida, M [1 ]
机构
[1] Toyohashi Univ Technol, Dept Elect & Elect Engn, Toyohashi, Aichi 4418580, Japan
关键词
silicon anodization; stiction; fractal; water contact angle; SOI; 73% HF;
D O I
10.1016/S0924-4247(98)00229-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Silicon anodization process has been applied to prevent both 'after-rinse stiction' and 'in-use stiction' for the sensors with SOI structure. The anodization process roughened the silicon surface causing hillocks of a few tens of nanometer in height and a few hundreds of nanometer in diameter, resulting in increment of water contact angle above 100 degrees as expected from a theory of fractal structure. Prevention effect for 'after-rinse stiction' was evaluated with silicon cantilever beam array fabricated by SOI structure. The maximum detachment length became three times longer than that of the beam on usual silicon surface. The Toughening of silicon surface reduces the actual contact area, and hence, it is effective in preventing 'in-use stiction'. The anodization process was also performed using 73% HF solution without causing attack for aluminum metallization. (C) 1999 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:153 / 159
页数:7
相关论文
共 21 条
  • [1] ADAMSON AW, 1990, PHYSICAL CHEM SURFAC
  • [2] ALLEY RL, 1993, P 7 INT C SOL STAT S, P288
  • [3] BROSNIHAN TJ, 1997, P 9 INT C SOL STAT S, P637
  • [4] FENG ZC, 1994, POROUS SILICON, pCH15
  • [5] GENNISSEN PTJ, 1997, P TRANSD 97 CHIC US, P225
  • [6] FRACTAL APPLICATIONS - WETTABILITY AND CONTACT-ANGLE
    HAZLETT, RD
    [J]. JOURNAL OF COLLOID AND INTERFACE SCIENCE, 1990, 137 (02) : 527 - 533
  • [7] HOUSTON MR, 1996, SOL STAT SENS ACT WO, P42
  • [8] Polysilicon integrated microsystems: Technologies and applications
    Howe, RT
    Boser, BE
    Pisano, AP
    [J]. SENSORS AND ACTUATORS A-PHYSICAL, 1996, 56 (1-2) : 167 - 177
  • [9] Comparative evaluation of drying techniques for surface micromachining
    Kim, CJ
    Kim, JY
    Sridharan, B
    [J]. SENSORS AND ACTUATORS A-PHYSICAL, 1998, 64 (01) : 17 - 26
  • [10] PHOTORESIST-ASSISTED RELEASE OF MOVABLE MICROSTRUCTURES
    KOBAYASHI, D
    KIM, CJ
    FUJITA, H
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1993, 32 (11A): : L1642 - L1644