Undoped TiO2 and nitrogen-doped TiO2 thin films deposited by atomic layer deposition on planar and architectured surfaces for photovoltaic applications

被引:11
|
作者
Tian, Liang [1 ]
Soum-Glaude, Adurey [1 ]
Volpi, Fabien [1 ]
Salvo, Luc [1 ]
Berthome, Gregory [1 ]
Coindeau, Stephane [1 ]
Mantoux, Arnaud [1 ]
Boichot, Raphael [1 ]
Lay, Sabine [1 ]
Brize, Virginie [1 ]
Blanquet, Elisabeth [1 ]
Giusti, Gael [2 ]
Bellet, Daniel [2 ]
机构
[1] Univ Grenoble Alpes, CNRS, SIMaP Lab, F-38000 Grenoble, France
[2] Univ Grenoble Alpes, CNRS, LMGP Lab, F-38000 Grenoble, France
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 2015年 / 33卷 / 01期
关键词
SILICON SOLAR-CELLS; CHEMICAL-VAPOR-DEPOSITION; TRANSPARENT ELECTRODES; OPTICAL-PROPERTIES; PERFORMANCE;
D O I
10.1116/1.4904025
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Undoped and nitrogen doped TiO2 thin films were deposited by atomic layer deposition on planar substrates. Deposition on 3D-architecture substrates made of metallic foams was also investigated to propose architectured photovoltaic stack fabrication. All the films were deposited at 265 degrees C and nitrogen incorporation was achieved by using titanium isopropoxide, NH3 and/or N2O as precursors. The maximum nitrogen incorporation level obtained in this study was 2.9 at. %, resulting in films exhibiting a resistivity of 115 Omega cm (+/-10 Omega cm) combined with an average total transmittance of 60% in the 400-1000 nm wavelength range. Eventually, TiO2 thin films were deposited on the 3D metallic foam template. (C) 2014 American Vacuum Society.
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页数:8
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