Inductive plasma sources for plasma implantation and deposition

被引:21
作者
Tuszewski, M [1 ]
Henins, I [1 ]
Nastasi, M [1 ]
Scarborough, WK [1 ]
Walter, KC [1 ]
Lee, DH [1 ]
机构
[1] Los Alamos Natl Lab, Los Alamos, NM 87545 USA
关键词
inductive plasma sources; plasma deposition; plasma ion implantation;
D O I
10.1109/27.747883
中图分类号
O35 [流体力学]; O53 [等离子体物理学];
学科分类号
070204 ; 080103 ; 080704 ;
摘要
External and reentrant radio frequency inductive plasma sources are developed for plasma ion implantation and deposition processes in a 1.8 m(3) vacuum vessel. Plasma densities in the range 10(16)-10(17) m(-3) are desirable for the above processes. External plasma sources could not yield the required plasma densities because of high particle losses in the transition region between the source and the main vessel. The particle losses are clarified through experiments and analysis, with and without multipole magnetic confinement. Reentrant plasma sources eliminate transmission losses and yield high plasma densities with good spatial uniformity.
引用
收藏
页码:1653 / 1660
页数:8
相关论文
共 14 条
[1]   PLASMA SOURCE ION-IMPLANTATION TECHNIQUE FOR SURFACE MODIFICATION OF MATERIALS [J].
CONRAD, JR ;
RADTKE, JL ;
DODD, RA ;
WORZALA, FJ ;
TRAN, NC .
JOURNAL OF APPLIED PHYSICS, 1987, 62 (11) :4591-4596
[2]  
ECKERT HU, 1974, HIGH TEMP SCI, V6, P99
[3]  
*HID AN LTD, 1996, EL PLASM PROB
[4]  
LAFRAMBOISE JG, 1966, UTIAS100
[5]  
Lieberman M. A., 1994, PRINCIPLES PLASMA DI
[6]  
LIEBERMAN MA, 1998, PLASMA SOURCES SCI T, V5, P1198
[7]   MAGNETIC MULTIPOLE CONTAINMENT OF LARGE UNIFORM COLLISIONLESS QUIESCENT PLASMAS [J].
LIMPAECHER, R ;
MACKENZIE, KR .
REVIEW OF SCIENTIFIC INSTRUMENTS, 1973, 44 (06) :726-731
[8]  
REJ DJ, 1996, HDB THIN FILM PROCES
[9]   A pulsed inductively coupled plasma source for plasma-based ion implantation [J].
Tuszewski, M ;
Scheuer, JT ;
Adler, RA .
SURFACE & COATINGS TECHNOLOGY, 1997, 93 (2-3) :203-208
[10]   The accuracy of Langmuir probe ion density measurements in low-frequency RF discharges [J].
Tuszewski, M ;
Tobin, JA .
PLASMA SOURCES SCIENCE & TECHNOLOGY, 1996, 5 (04) :640-647