Accurate measurement of very small line patterns in critical dimension scanning electron microscopy using model-based library matching technique

被引:6
作者
Shishido, Chie [1 ]
Tanaka, Maki [1 ]
Osaki, Mayuka [1 ]
机构
[1] Hitachi Ltd, Prod Engn Res Lab, Totsuka Ku, Kanagawa 2440817, Japan
来源
JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS | 2011年 / 10卷 / 01期
关键词
critical dimension scanning electron microscopy; critical dimension bias; model-based library; reference metrology; Monte Carlo simulation; atomic force microscopy; CD-SEM; BIAS;
D O I
10.1117/1.3541780
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Our purpose is to reduce the critical dimension (CD) bias for very small patterns with line widths of <15 nm. The model-based library (MBL) method, which estimates the dimensions and shape of a target pattern by comparing a measured scanning electron microscopy image waveform with a library of simulated waveforms, was modified in two ways. The first modification was the introduction of line-width variation into the library to overcome problems caused by significant changes in waveform due to changes in both sidewall shape and line width. The second modification was the fixation of MBL tool parameters to overcome problems caused by the reduction in pattern shape information due to merging of right and left white bands. We verified the effectiveness of the modified MBL method by applying it to actual silicon patterns with line widths in the range 10-30 nm. The CD bias measured by MBL method for three heights (20, 50, and 80%) was consistent with the atomic force microscopy results. The CD biases at all heights were <0.5 nm, and the slopes of the CD biases with respect to the CD were <3%. (C) 2011 Society of Photo-Optical Instrumentation Engineers (SPIE). [DOI: 10.1117/1.3541780]
引用
收藏
页数:10
相关论文
共 16 条
  • [1] An inverse scattering approach to SEM line width measurements
    Davidson, MP
    Vladár, AE
    [J]. METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XIII, PTS 1 AND 2, 1999, 3677 : 640 - 649
  • [2] LEVINSON HJ, 1999, LITHOGRAPHY PROCE TT, V28, P141
  • [3] Lowney J. R., 1996, Scanning Microscopy, V10, P667
  • [4] Improved CD-SEM optics with retarding and boosting electric fields
    Ose, Y
    Ezumi, M
    Todokoro, H
    [J]. METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XIII, PTS 1 AND 2, 1999, 3677 : 930 - 939
  • [5] Rana N., 2009, P SPIE, V7272, P7272
  • [6] Shishido C., 2009, P SPIE, P7272
  • [7] Application of model-based library approach to Si3N4 hardmask measurements
    Tanaka, Maki
    Shishido, Chie
    Nagatomo, Wataru
    Watanabe, Kenji
    [J]. METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XXII, PTS 1 AND 2, 2008, 6922 (1-2):
  • [8] CD bias reduction in CD-SEM linewidth measurements for advanced lithography
    Tanaka, Maki
    Meessen, Jeroen
    Shishido, Chie
    Watanabe, Kenji
    Minnaert-Janssen, Ingrid
    Vanoppen, Peter
    [J]. METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XXII, PTS 1 AND 2, 2008, 6922 (1-2):
  • [9] Influence of electron incident angle distribution on CD-SEM linewidth measurements
    Tanaka, Maki
    Shishido, Chie
    Kawada, Hiroki
    [J]. METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XX, PTS 1 AND 2, 2006, 6152
  • [10] Effect of bias variation on total uncertainty of CD measurements
    Ukraintsev, VA
    [J]. METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XVII, PTS 1 AND 2, 2003, 5038 : 644 - 650