An Effective Lift-Off Method for Patterning High-Density Gold Interconnects on an Elastomeric Substrate

被引：53
作者：
Guo, Liang [1 ,2 ]
DeWeerth, Stephen P. [1 ,2 ]
机构：
[1] Georgia Inst Technol, Wallace H Coulter Dept Biomed Engn, Atlanta, GA 30332 USA
[2] Emory Univ, Atlanta, GA 30332 USA
来源：
SMALL | 2010年 / 6卷 / 24期
基金：
美国国家卫生研究院;
关键词：
MULTIELECTRODE ARRAY; SURFACE STIMULATION; PHOTORESIST; FILMS;
D O I：
10.1002/smll.201001456
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
High-resolution, high-density gold interconnects are effectively patterned on an elastomeric substrate. A 3 cm cable of ten gold wires with 10 μm width and 20 μm pitch is achieved, successfully demonstrating density increases of more than one order of magnitude from previously established work. Many applications in the fields of stretchable electronics and conformable neural interfaces will benefit from these fabrication developments. Copyright © 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
引用
收藏
页码：2847 / 2852
页数：6
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