Optimization of wire connections design for power electronics

被引：17

作者：

Celnikier, Y. ^{[1
]}

Dupont, L. ^{[1
]}

Herve, E. ^{[2
]}

Coquery, G. ^{[1
]}

Benabou, L. ^{[2
]}

机构：

[1] IFSTTAR, LTN, F-78000 Versailles, France

[2] Univ Versailles St Quentin, LISV, F-78035 Versailles, France

来源：

MICROELECTRONICS RELIABILITY | 2011年 / 51卷 / 9-11期

关键词：

D O I：

10.1016/j.microrel.2011.06.058

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In automotive power electronics, low cost and reliability requirements both demand to optimize each part of the package in order to increase its life time during use. The wire bonding breakage accounts for one of the most common failures observed on power modules. In particular, the heel crack mechanism, mainly due to Joule self-heating, can occur in the module, leading to its death. Thus, the wire geometry design has to be set up to maximize its endurance. This paper presents an analytical method able to predict the optimal wire length regarding a wire displacement criterion. Finally, comparisons between experimental results and predictions of the analytical model are given. Published by Elsevier Ltd.

引用

页码：1892 / 1897

页数：6

共 11 条

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