Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints

被引：1
作者：
Zhao Guo-ji [1 ,2 ]
Wen Guang-hua [1 ]
Sheng Guang-min [1 ]
Jing Yan-xia [1 ]
机构：
[1] Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
[2] Chongqing Ind Polytech Coll, Chongqing 401120, Peoples R China
来源：
JOURNAL OF CENTRAL SOUTH UNIVERSITY | 2016年 / 23卷 / 08期
基金：
中国国家自然科学基金;
关键词：
rapid solidification; Sn-Zn-RE solder; microstructure; interfacial property; MECHANICAL-PROPERTIES; MICROSTRUCTURE;
D O I：
10.1007/s11771-016-3237-3
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd (mass fraction) addition on the microstructure, thermodynamic characteristic of Sn-9Zn solder alloy were analyzed. The tensile shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the microstructure of Sn-9Zn-0.1Pr(/Nd) alloys. After rapid solidification, the effects of Pr/Nd addition on microstructure are depressed. The pasty range of the rapidly solidified Sn-Zn-RE solders is also reduced significantly. The mechanical properties of solder/Cu joints are obviously improved using the rapidly solidified Sn-9Zn-0.1Pr(/Nd) solder alloy, which results in the formation of uniform interface. The promotion effect of Nd addition in Sn-9Zn alloy on the interfacial reaction of solder/Cu joint is more remarkable than that of Pr.
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页码：1831 / 1838
页数：8
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