InGaN Metal-Semiconductor-Metal Photodetectors With Aluminum Nitride Cap Layers

被引:8
作者
Lee, Kai-Hsuan [1 ]
Chang, Ping-Chuan [2 ]
Chang, Shoou-Jinn [3 ,4 ]
Wu, San-Lein [5 ]
机构
[1] Natl Synchrotron Radiat Res Ctr, Nano Sci Grp, Sci Res Div, Hsinchu 30076, Taiwan
[2] Kun Shan Univ, Dept Electroopt Engn, Tainan 71003, Taiwan
[3] Natl Cheng Kung Univ, Adv Optoelect Technol Ctr, Ctr Micro Nano Sci & Technol, Inst Microelect, Tainan 70101, Taiwan
[4] Natl Cheng Kung Univ, Adv Optoelect Technol Ctr, Ctr Micro Nano Sci & Technol, Dept Elect Engn, Tainan 70101, Taiwan
[5] Cheng Shiu Univ, Dept Elect Engn, Kaohsiung 83347, Taiwan
关键词
Aluminum nitride; InGaN; photodetectors; EFFECTIVE-MASS; GAN; MECHANISM; SEGREGATION; PHOTODIODES; NOISE;
D O I
10.1109/JQE.2011.2158389
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report on the fabrication and characterization of InGaN metal-semiconductor-metal photodetectors (PDs) by using triethylgallium gallium source for the growth of InGaN active layers and in-situ aluminum nitride as cap layers. Improved characteristics such as reduced dark leakage current, large ultra violet (UV)-to-visible rejection ratio, low noise level, and high detectivity can be achieved in our devices. Current transport mechanisms in InGaN PDs were also investigated. Fowler-Nordheim mechanism associated with the defect-related tunneling should be included besides the traditional thermionic emission model.
引用
收藏
页码:1107 / 1112
页数:6
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