共 50 条
- [1] Novel Programmable Package-level Thermal Evaluation System PROCEEDINGS OF THE 17TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2018), 2018, : 354 - 359
- [2] Package-Level Thermal Management of a 3D Embedded Wafer Level Package PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 78 - 82
- [3] Analytical Modeling for Prediction of Chip Package-level Thermal Performance 2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2016, : 254 - 261
- [4] INVESTIGATION OF BOARD-LEVEL AND PACKAGE-LEVEL DROP RELIABILITY OF RF MEMS PACKAGES IMCE2009: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 5, 2010, : 225 - 230
- [5] JOINT DEVELOPMENT OF A PACKAGE-LEVEL THERMAL INTERFACE MATERIAL TEST SYSTEM IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 2, 2010, : 615 - 618
- [6] TSV and Cu-Cu Direct Bond Wafer and Package-Level Reliability 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 41 - 48
- [7] Package-level analysis: Gaining momentum Electronic Device Failure Analysis, 2004, 6 (01): : 46 - 47
- [8] Aging in nonlinear optical polymer waveguides ANGEWANDTE MAKROMOLEKULARE CHEMIE, 1997, 252 : 153 - 166
- [9] Chip-Level and Package-Level Thermal Constraints in Power Semiconductor Switch Modules 2015 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP), 2015, : 79 - 82