Palmitic acid-carbon dot hybrid vesicles for absorption of uric acid

被引:7
作者
Boruah, Jayanta S. [1 ]
Chowdhury, Devasish [1 ]
机构
[1] Inst Adv Study Sci & Technol, Mat Nanochem Lab, Div Phys Sci, Garchuk 781035, Guwahati, India
关键词
Carbon dot; Vesicle; Uric acid; Nanocomposite; TOPICAL DELIVERY; SILICON-WAFERS; ASCORBIC-ACID; QUANTUM DOTS; FATTY-ACID; NANOPARTICLES; DOPAMINE; GRAPHENE; TRANSFORMATIONS; NANOTUBES;
D O I
10.1007/s13204-020-01374-2
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Human health is always sensitive to the effect of toxin developed due to various reason like metabolic activities, excessive material uptake etc. in the body. Hence, there is a need to develop ways to remove such toxin. In this work, we successfully fabricated a Carbon dot-palmitic acid hybrid vesicles and demonstrated that it can absorb uric acid (UA) which is taken in this work as a model toxin. Interestingly, the nanohybrid was found to be efficient UA absorber (80%) compare to pure palmitic acid vesicles (60%) confirming the role of carbon dot in absorption and hence removal of uric acid. The electrostatic interaction operated between carbon dot and uric acid inside the palmitic acid vesicles is the prime factor for the UA absorption. Development of such nanohybrid vesicles system will lead to system which can be used as toxin removal from our body.
引用
收藏
页码:2207 / 2218
页数:12
相关论文
共 65 条
[61]   A novel approach of mechanical chemical grinding [J].
Zhang, Zhenyu ;
Cui, Junfeng ;
Wang, Bo ;
Wang, Ziguang ;
Kang, Renke ;
Guo, Dongming .
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 726 :514-524
[62]   A novel approach of chemical mechanical polishing for a titanium alloy using an environment-friendly slurry [J].
Zhang, Zhenyu ;
Shi, Zhifeng ;
Du, Yuefeng ;
Yu, Zhijian ;
Guo, Liangchao ;
Guo, Dongming .
APPLIED SURFACE SCIENCE, 2018, 427 :409-415
[63]   A novel approach of high speed scratching on silicon wafers at nanoscale depths of cut [J].
Zhang, Zhenyu ;
Guo, Dongming ;
Wang, Bo ;
Kang, Renke ;
Zhang, Bi .
SCIENTIFIC REPORTS, 2015, 5
[64]   Changes in surface layer of silicon wafers from diamond scratching [J].
Zhang, Zhenyu ;
Wang, Bo ;
Kang, Renke ;
Zhang, Bi ;
Guo, Dongming .
CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2015, 64 (01) :349-352
[65]   Fabrication and size prediction of crystalline nanoparticles of silicon induced by nanogrinding with ultrafine diamond grits [J].
Zhang, Zhenyu ;
Huo, Fengwei ;
Zhang, Xianzhong ;
Guo, Dongming .
SCRIPTA MATERIALIA, 2012, 67 (7-8) :657-660