Curing kinetics study of epoxy resin/flexible amine toughness systems by dynamic and isothermal DSC

被引：160

作者：

Cai, Hongyang ^{[1
]}

Li, Peng ^{[1
]}

Sui, Gang ^{[1
]}

Yu, Yunhua ^{[1
]}

Li, Gang ^{[1
]}

Yang, Xiaoping ^{[1
]}

Ryu, Seungkon ^{[2
]}

机构：

[1] Beijing Univ Chem Technol, Key Lab Beijing City Preparat & Proc Novel Polyme, Beijing 100029, Peoples R China

[2] Chungnam Natl Univ, Dept Chem Engn, Taejon 305764, South Korea

来源：

THERMOCHIMICA ACTA | 2008年 / 473卷 / 1-2期

关键词：

activation energy; differential scanning calorimetry (DSC); epoxy; flexible curing agent; kinetics;

D O I：

10.1016/j.tca.2008.04.012

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Curing kinetics of two epoxy resin/flexible amine systems was studied by dynamic and isothermal differential scanning calorimetry (DSC). In dynamic experiments, the activation energy at different curing degree was computed under nonisothermal condition by using isoconversion method. At the same time, the isothermal experimental data was simulated by nonlinear least-squares fitting (NLSF). The results showed that the Arrhenius activation energy (E) increased with the increasing curing degree of diglycidyl ether of bisphenol A (DGEBA)-Jeffamine (T403) system, while in the DGEBA-D230 system activation energy decreased in the initial stage, and then increased when the value of alpha (the curing degree) was within the range of 0.1-0.4, and afterwards decreased. Under the isothermal condition, the Kamal's model was suitable to simulate two systems in the whole curing process. (C) 2008 Published by Elsevier B.V.

引用

页码：101 / 105

页数：5

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