Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles

被引：43

作者：

Guo, F ^{[1
]}

Lee, J ^{[1
]}

Lucas, JP ^{[1
]}

Subramanian, KN ^{[1
]}

Bieler, TR ^{[1
]}

机构：

[1] Michigan State Univ, Dept Mat Sci & Mech, E Lansing, MI 48824 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2001年 / 30卷 / 09期

基金：

美国国家科学基金会;

关键词：

lead-free solder; eutectic Sn-3.5Ag solder; composite solder; creep;

D O I：

10.1007/s11664-001-0153-5

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The creep deformation behavior of eutectic Sn-3.5Ag based Ni particle reinforced composite solder joints was investigated. The Ni particle reinforced composite solder was prepared by mechanically dispersing 15 vol.% of Ni particles into eutectic Sn-3.5Ag solder paste. Static-loading creep tests were carried out on solder joint specimens at 25 degreesC, 65 degreesC, and 105 degreesC, representing homologous temperatures ranging from 0.6 to 0.78. A novel-design, miniature creep-testing frame was utilized in this study. Various creep parameters such as the global and localized creep strain, steady-state creep rate, onset of tertiary creep, and the activation energy for creep were quantified by mapping the distorted laser ablation pattern imprinted on the solder joint prior to testing. The Ni-reinforced composite solder joint showed improved creep resistance compared to the results previously reported for eutectic Sn-3.5Ag solder, Sn-4.0Ag-0.5Cu solder alloys, and for eutectic Sn-3.5Ag solder reinforced with Cu or Ag particle reinforcements. The activation energy for creep was similar to0.52 eV for Sn-3.5Ag and Sn-4Ag-0.5Cu solder alloys. The activation energies ranged from 0.55-0.64 eV for Cu, Ag, and Ni reinforced composite solder joints, respectively. Most often, creep fracture occurred closer to one side of the solder joint within the solder matrix.

引用

页码：1222 / 1227

页数：6

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