Efficient Metallic Carbon Nanotube Removal for Highly-Scaled Technologies

被引:0
作者
Shulaker, Max M. [1 ]
Hills, Gage [1 ]
Wu, Tony F. [1 ]
Bao, Zhenan [2 ]
Wong, H. -S. Philip [1 ]
Mitra, Subhasish [1 ,3 ]
机构
[1] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
[2] Stanford Univ, Chem Engn, Stanford, CA 94305 USA
[3] Stanford Univ, Comp Sci, Stanford, CA 94305 USA
来源
2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2015年
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
While carbon nanotube (CNT) field-effect transistors (CNFETs) promise to improve the performance and energy efficiency of digital systems beyond the limitations of silicon CMOS, the presence of metallic CNTs (m-CNTs) remains a major challenge. Existing techniques for removing m-CNTs are inadequate, as they face one or more of the following scalability challenges: scaling to large circuits (>= 99.99% of m-CNTs must be removed without inadvertently removing semiconducting CNTs, s-CNTs), scaling to short channel lengths (for highly-scaled contacted gate pitch (CPP)), and scaling to small inter-CNT spacing (for high CNT densities required for high CNFET I-ON). We demonstrate a new m-CNT removal technique that, for the first time, overcomes all of these scalability challenges, as it: (a) removes >= 99.99% of m-CNTs vs. <= 1% of s-CNTs, (b) scales to any arbitrary CPP, and (c) scales to high CNT densities (>= 200 CNTs/mu m).
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