A Review of the Computer Based Simulation of Electro-Thermal Design of Power Electronics Devices

被引:0
|
作者
Shahjalal, Mohammad [1 ]
Lu, H. [1 ]
Bailey, C. [1 ]
机构
[1] Univ Greenwich, Dept Math Sci, London SE10 9LS, England
关键词
THERMAL-MODEL; IGBT; INVERTER; OPTIMIZATION; METHODOLOGY; DIODE;
D O I
暂无
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
Temperature is one of the most important factors that affect the performance of power electronics systems. It is important that thermal management is considered initially at the design stage of the systems. Because of its advantages of being low cost, high accuracy, and adaptable, computer simulation based analysis and design techniques have become important tools for power electronics designers. This paper presents the state of the art design and analysis techniques that are used for power electronics components and systems design. The focus is on the review of the existing computer based simulation of electro-thermal design solution techniques. Methodologies of electro-thermal modelling of power electronics systems such as converters are explored, their advantages and disadvantages of them are discussed and the benefits of computer based simulation over the existing methodologies are highlighted.
引用
收藏
页数:6
相关论文
共 50 条
  • [1] Electro-Thermal Modeling of SiC Power Devices for Circuit Simulation
    Yin, Shan
    Wang, Tao
    Tseng, K. J.
    Zhao, Jiyun
    Hu, Xiaolei
    39TH ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY (IECON 2013), 2013, : 718 - 723
  • [2] Electro-thermal simulation and design of silicon based bioanalytical micro-devices
    Simion, M
    Kleps, I
    Angelescu, A
    Miu, M
    Nedelcu, OT
    2004 IEEE International Conference on Industrial Technology (ICIT), Vols. 1- 3, 2004, : 1002 - 1007
  • [3] Application-Aware Lifetime Model for Power Devices based on Electro-Thermal Simulation
    Pop, Ciprian V.
    Buzo, Andi
    Diaconu, Cristian V.
    Pelz, Georg
    Cucu, Horia
    Burileanu, Corneliu
    2019 INTERNATIONAL SEMICONDUCTOR CONFERENCE (CAS 2019), 42ND EDITION, 2019, : 177 - 180
  • [4] Thermal networks for electro-thermal analysis of power devices
    Codecasa, L
    D'Amore, D
    Maffezzoni, P
    MICROELECTRONICS JOURNAL, 2001, 32 (10-11) : 817 - 822
  • [5] Electro-Thermal Simulation of Power DMOS Devices Operating under Fast Thermal Cycling
    Florea, Ciprian
    Topa, Vasile
    Simon, Dan
    2020 IEEE 26TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2020), 2020, : 368 - 371
  • [6] A New Tightly-Coupled Transient Electro-Thermal Simulation Method for Power Electronics
    Chen, Quan
    Schoenmaker, Wim
    2016 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD), 2016,
  • [7] Datasheet Driven Electro-Thermal Real-Time Simulation of Power Electronics Converter
    Tang, Jiaxin
    Bai, Hao
    Ma, Ruiqing
    Zhao, Dongdong
    Wang, Nan
    Huang, Gang
    2022 4TH INTERNATIONAL CONFERENCE ON SMART POWER & INTERNET ENERGY SYSTEMS, SPIES, 2022, : 208 - 213
  • [8] Electro-thermal simulation including a temperature distribution inside power semiconductor devices
    Allard, B
    Garrab, H
    Morel, H
    INTERNATIONAL JOURNAL OF ELECTRONICS, 2005, 92 (04) : 189 - 213
  • [9] Electro-thermal simulation of power electronic systems
    Turkes, P
    Sigg, J
    MICROELECTRONICS JOURNAL, 1998, 29 (11) : 785 - 790
  • [10] Electronics Structures Hidden Defect Evaluation by Electro-Thermal Simulation
    Stoynova, Anna
    Bonev, Borislav
    2021 44TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2021,