Review of atomic layer deposition process, application and modeling tools

被引:41
|
作者
Kunene, Thokozani Justin [1 ]
Tartibu, Lagouge Kwanda [1 ]
Ukoba, Kingsley [2 ]
Jen, Tien-Chien [2 ]
机构
[1] Univ Johannesburg, Dept Mech & Ind Engn Technol, Johannesburg, South Africa
[2] Univ Johannesburg, Dept Mech Engn Sci, Johannesburg, South Africa
关键词
Atomic layer deposition; Sticking coefficient; Simulation; Thin films; MOLECULAR-DYNAMICS SIMULATION; THIN-FILMS; REACTION-MECHANISM; SILICON; GROWTH; TEMPERATURE; NUCLEATION; METAL; OXIDE; O-2;
D O I
10.1016/j.matpr.2022.02.094
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Atomic layer deposition is a highly sought-after technique with high conformal and quality film deposition. This study reviewed thin-film technology comprehensively and narrowed it to atomic layer deposition. Atomic layer deposition and associated terms and technology were discussed in detail. The study will be helpful to everyone interested in high precision and quality film deposition. The paper also discussed atomic layer deposition models and simulation tools with relevant studies examined. Molecular dynamics, Monte Carlo, and other models examined atomic layer deposition. Precision control of the sticking coefficients using Langmuir was also discussed. The paper will contribute to the body of knowledge for thin film, atomic layer deposition, modeling, and simulations with diverse real-life applications. (C) 2021 The Authors. Published by Elsevier Ltd.
引用
收藏
页码:S95 / S109
页数:15
相关论文
共 50 条
  • [1] Atomic layer deposition of vanadium oxides: process and application review
    Prasadam, V. P.
    Bahlawane, N.
    Mattelaer, F.
    Rampelberg, G.
    Detavernier, C.
    Fang, L.
    Jiang, Y.
    Martens, K.
    Parkin, I. P.
    Papakonstantinou, I
    MATERIALS TODAY CHEMISTRY, 2019, 12 : 396 - 423
  • [2] Atomic layer deposition and application of group IIInitrides semiconductor and their alloys
    Qiu, Peng
    Liu, Heng
    Zhu, Xiao-li
    Tian, Feng
    Du, Meng-Chao
    Qiu, Hong -Yu
    Chen, Guan-Liang
    Hu, Yu-Yu
    Kong, De-Lin
    Yang, Jin
    Wei, Hui-Yun
    Peng, Ming-Zeng
    Zheng, Xin-He
    ACTA PHYSICA SINICA, 2024, 73 (03)
  • [3] Review of molecular layer deposition process and application to area selective deposition via graphitization
    Baek, GeonHo
    Yang, Hae Lin
    Park, Gi-Beom
    Park, Jin-Seong
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2023, 62 (SG)
  • [4] Atomic Layer Deposition from Dissolved Precursors
    Wu, Yanlin
    Doehler, Dirk
    Barr, Maissa
    Oks, Elina
    Wolf, Marc
    Santinacci, Lionel
    Bachmann, Julien
    NANO LETTERS, 2015, 15 (10) : 6379 - 6385
  • [5] Modeling alumina atomic layer deposition reaction kinetics during the trimethylaluminum exposure
    Travis, Curtisha D.
    Adomaitis, Raymond A.
    THEORETICAL CHEMISTRY ACCOUNTS, 2013, 133 (01) : 3 - 11
  • [6] ATOMIC LAYER DEPOSITION OF TIN DIOXIDE NANOFILMS: A REVIEW
    Nazarov, D. V.
    Bobrysheva, N. P.
    Osmolovskaya, O. M.
    Osmolovsky, M. G.
    Smirnov, V. M.
    REVIEWS ON ADVANCED MATERIALS SCIENCE, 2015, 40 (03) : 262 - 275
  • [7] Step coverage modeling of thin films in atomic layer deposition
    Kim, Ja-Yong
    Ahn, Ji-Hoon
    Kang, Sang-Won
    Kim, Jin-Hyock
    JOURNAL OF APPLIED PHYSICS, 2007, 101 (07)
  • [8] Integrated Sustainability Analysis of Atomic Layer Deposition for Microelectronics Manufacturing
    Yuan, Chris Y.
    Dornfeld, David A.
    JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME, 2010, 132 (03): : 0309181 - 0309187
  • [9] A brief review of atomic layer deposition: from fundamentals to applications
    Johnson, Richard W.
    Hultqvist, Adam
    Bent, Stacey F.
    MATERIALS TODAY, 2014, 17 (05) : 236 - 246
  • [10] Nanoengineering Heterogeneous Catalysts by Atomic Layer Deposition
    Singh, Joseph A.
    Yang, Nuoya
    Bent, Stacey F.
    ANNUAL REVIEW OF CHEMICAL AND BIOMOLECULAR ENGINEERING, VOL 8, 2017, 8 : 41 - 62