Small Pixel Uncooled Imaging FPAs and Applications

被引：9

作者：

Blackwell, Richard ^{[1
]}

Franks, Glen ^{[1
]}

Lacroix, Daniel ^{[1
]}

Hyland, Sandra ^{[1
]}

Murphy, Robert ^{[1
]}

机构：

[1] BAE Syst, Soldier & Vehicle Solut, Lexington, MA 02421 USA

来源：

INFRARED TECHNOLOGY AND APPLICATIONS XXXVI, PTS 1 AND 2 | 2010年 / 7660卷

关键词：

Microbolometer; uncooled FPA; 17 mu m; thermal imaging;

D O I：

10.1117/12.852970

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

BAE Systems continues to make dramatic progress in uncooled microbolometer sensors and applications. This paper will review the latest advancements in microbolometer technology at BAE Systems, including the development status of 17 micrometer pixel pitch detectors and imaging modules which are entering production and will be finding their way into BAE Systems products and applications. Benefits include increased die per wafer and potential benefits to SWAP for many applications. Applications include thermal weapons sights, thermal imaging modules for remote weapon stations, vehicle situational awareness sensors and mast/pole mounted sensors.

引用

页数：7