Comparative studies of perfluorocarbon alternative gas plasmas for contact hole etch

Saturated perfluorocarbons (PFCs) such as CF4, C2F6, C3F8 and c-C4F8 are used as dry-etch gases in the semiconductor industry. They have a significant greenhouse effect. Unsaturated fluorocarbons can be alternated with these PFCs because of their easy decomposition in the atmosphere. The authors have diagnosed the plasmas generated from straight-chain unsaturated gases such as C3F6, C4F6, C4F8 and C5F8 in an inductively coupled plasma reactor and have compared their etch properties. It was found that high selectivity has been obtained in a C4F6 or C5F8 plasma without mixing any specific gases. Fine contact holes of approximately 100 nm in diameter also have been obtained Using C4F6 or C5F8 with or without adding Ar or O-2. These good etch properties Of C4F6 and C5F8 have been achieved as a consequence of the appropriate balance between the lower density of fluorocarbon polymers and the dominant etching species CF+ with lower etching efficiency. It can be concluded that C4F6 and C5F8 can be used as PFC replacements for the dry-etch gas.