Microwave Acoustic Wave Devices: Recent Advances on Architectures, Modeling, Materials, and Packaging

被引：116
作者：
Hagelauer, Amelie [1 ]
Fattinger, Gernot [2 ]
Ruppel, Clemens C. W. [3 ]
Ueda, Masanori [4 ]
Hashimoto, Ken-ya [5 ]
Tag, Andreas [2 ]
机构：
[1] Friedrich Alexander Univ Erlangen Nuremberg, Inst Elect Engn, D-91054 Erlangen, Germany
[2] Qorvo Inc, BAW Res & Dev, Apopka, FL 32703 USA
[3] EPCOS AG, D-81739 Munich, Germany
[4] Tajyo Yuden Ltd, Akashi, Hyogo 6748555, Japan
[5] Chiba Univ, Grad Sch Engn, Chiba 2638522, Japan
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2018年 / 66卷 / 10期
关键词：
Bulk acoustic wave (BAW) devices; carrier aggregation (CA); filter; front-end modules; high power; multiplexer; nonlinearity; piezoelectric materials; polyharmonic distortion (PHD); resonator; surface acoustic wave (SAW) devices; wafer-level package (WLP); FILM BAW RESONATORS; DISSIPATED POWER; SAW SUBSTRATE; FILTERS; FBAR; SUPPRESSION; DUPLEXER; SIMULATIONS; MODES;
D O I：
10.1109/TMTT.2018.2854160
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper reviews applications of acoustic wave devices in mobile communication. After a general and historical introduction to bulk acoustic wave (BAW) and surface acoustic wave (SAW) devices, a review is given on the architectures where acoustic wave devices are applied driving the requirements on the SAW and BAW components. Following this, we discuss the progress in technology important materials. Next, an overview on the modeling and characterization of SAW and BAW at high power levels is given. Finally an overview of packaging technologies and an outlook to future developments is provided. Finally, an outlook to future developments is provided.
引用
收藏
页码：4548 / 4562
页数：15
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