Analytical and finite element study on warpage and stress of 2.5D chip-package structures

被引：0

作者：

Hao, Sida ^{[1
]}

Chu, Weishen ^{[2
]}

Ho, Paul S. ^{[2
]}

Lee, Joonsik Sohn ^{[3
]}

Huang, Rui ^{[1
]}

机构：

[1] Univ Texas Austin, Dept Aerosp Engn & Engn Mech, Austin, TX 78712 USA

[2] Univ Texas Austin, Dept Mech Engn, Austin, TX 78712 USA

[3] Samsung Elect, R&D Prod Dev Planning, Suwon, South Korea

来源：

2021 IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA) | 2021年

关键词：

chip-package interaction; warpage; stress; analytical solution; finite element analysis;

D O I：

10.1109/IPFA53173.2021.9617246

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

New analytical methods are proposed to investigate the warpage of 2.5D system in package (SIP) fabricated through different temperature steps based on laminate theories. The solutions apply in both axisymmetric and rectangular configurations for packages with different multilayer sections. A multi-step finite element (FE) model is developed to verify the analytical results and to examine stress distributions in the chip-package structures with respect to the fabrication steps. The analytical and FE results are in good agreement to account for the warpage at the chip scale, whereas the FE model provides local stress analysis at the micro-bump and solder ball levels that can be further extended for failure analysis.

引用

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