Enhanced thermal conductivity and viscosity of copper nanoparticles in ethylene glycol nanofluid

被引:350
作者
Garg, J. [1 ]
Poudel, B. [2 ]
Chiesa, M. [1 ]
Gordon, J. B. [1 ]
Ma, J. J. [1 ]
Wang, J. B. [4 ]
Ren, Z. F. [2 ]
Kang, Y. T. [5 ]
Ohtani, H. [3 ]
Nanda, J. [3 ]
McKinley, G. H. [1 ]
Chen, G. [1 ]
机构
[1] MIT, Dept Mech Engn, Cambridge, MA 02139 USA
[2] Boston Coll, Dept Phys, Chestnut Hill, MA 02467 USA
[3] Ford Motor Co, Res & Adv Engn, Mat & Nanotechnol Dept, Dearborn, MI 48121 USA
[4] Huazhong Univ Sci & Technol, Sch Environm Sci & Engn, Wuhan, Peoples R China
[5] Kyung Hee Univ, Sch Mech & Ind Engn, Seoul, South Korea
基金
美国国家科学基金会;
关键词
D O I
10.1063/1.2902483
中图分类号
O59 [应用物理学];
学科分类号
摘要
This study investigates the thermal conductivity and viscosity of copper nanoparticles in ethylene glycol. The nanofluid was prepared by synthesizing copper nanoparticles using a chemical reduction method, with water as the solvent, and then dispersing them in ethylene glycol using a sonicator. Volume loadings of up to 2% were prepared. The measured increase in thermal conductivity was twice the value predicted by the Maxwell effective medium theory. The increase in viscosity was about four times of that predicted by the Einstein law of viscosity. Analytical calculations suggest that this nanofluid would not be beneficial as a coolant in heat exchangers without changing the tube diameter. However, increasing the tube diameter to exploit the increased thermal conductivity of the nanofluid can lead to better thermal performance. (C) 2008 American Institute of Physics.
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页数:6
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