Remote Plasma Oxidation and Atomic Layer Etching of MoS2

被引:156
|
作者
Zhu, Hui [1 ]
Qin, Xiaoye [1 ]
Cheng, Lanxia [1 ]
Azcatl, Angelica [1 ]
Kim, Jiyoung [1 ]
Wallace, Robert M. [1 ]
机构
[1] Univ Texas Dallas, Dept Mat Sci & Engn, Richardson, TX 75080 USA
基金
美国国家科学基金会;
关键词
molybdenum disulfide; remote oxygen plasma; in situ XPS; band bending; atomic etching; TRANSITION-METAL DICHALCOGENIDES; IN-SITU; SURFACE MODIFICATION; WORK FUNCTION; MONOLAYER; FILMS; MOO3; XPS; TRANSISTORS; MULTILAYER;
D O I
10.1021/acsami.6b04719
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Exfoliated molybdenum disulfide (MoS2) is shown to chemically oxidize in a layered manner upon exposure to a remote O-2 plasma. X-ray photoelectron spectroscopy (XPS), low energy electron diffraction (LEED), and atomic force microscopy (AFM) are employed to characterize the surface chemistry, structure, and topography of the oxidation process and indicate that the oxidation mainly occurs on the topmost layer without altering the chemical composition of underlying layer. The formation of S-O bonds upon short, remote plasma exposure pins the surface Fermi level to the conduction band edge, while the MoOx formation at high temperature modulates the Fermi level toward the valence band through band alignment. A uniform coverage of monolayer amorphous MoO3 is obtained after 5 min or longer remote O-2 plasma exposure at 200 degrees C, and the MoO3 can be completely removed by annealing at 500 degrees C, leaving a clean ordered MoS2 lattice structure as verified by XPS, LEED, AFM, and scanning tunneling microscopy. This work shows that a remote O-2 plasma can be useful for both surface functionalization and a controlled thinning method for MoS2 device fabrication processes.
引用
收藏
页码:19119 / 19126
页数:8
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