UV curable pressure-sensitive adhesives for fabricating semiconductors. I. Development of easily peelable dicing tapes

被引：90

作者：

Ebe, K ^{[1
]}

Seno, H ^{[1
]}

Horigome, K ^{[1
]}

机构：

[1] LINTEC Corp, Res Lab, Warabi, Saitama 3350005, Japan

来源：

JOURNAL OF APPLIED POLYMER SCIENCE | 2003年 / 90卷 / 02期

关键词：

pressure-sensitive adhesives; UV curing; silicon wafer; dicing tape; adhesive deposit;

D O I：

10.1002/app.12673

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

In order to develop easily peelable dicing tapes from diced wafers, UV curing of various pressure-sensitive adhesives (PSAs) was studied. After UV irradiation, the adhesive strength of a PSA composition including a diacrylourethane oligomer (UDA) decreased drastically compared with other compositions. Because of network formation via UV irradiation, this composition had a greater volume contraction that might yield microvoids at the interface between the adhesive and the wafer, resulting in the loose adhesion. Its storage modulus increased up to about 1000 times that before UV curing, which was due to the crosslinking of the UDA component. It was suggested that the increased crosslinking density and the high internal coagulant energy of the UDA backbone structure caused a remarkable decrease of the adhesive strength. Furthermore, it was ascertained that the UV-irradiated UDA adhesives left few residual deposits on the wafer released from the tape. (C) 2003 Wiley Periodicals, Inc.

引用

页码：436 / 441

页数：6

共 7 条

[1] Electron beam curing of aliphatic unsaturated polyesters. I. Mechanistic study on converting to pressure-sensitive adhesives [J].