Ba termination of Ge(001) studied with STM

被引:7
作者
Koczorowski, W. [1 ,2 ]
Grzela, T. [3 ]
Radny, M. W. [2 ,4 ]
Schofield, S. R. [1 ,5 ]
Capellini, G. [6 ]
Czajka, R. [2 ]
Schroeder, T. [3 ,7 ]
Curson, N. J. [8 ]
机构
[1] UCL, London Ctr Nanotechnol, London, England
[2] Poznan Univ Tech, Inst Phys, PL-60965 Poznan, Poland
[3] IHP, D-15236 Frankfurt, Oder, Germany
[4] Univ Newcastle, Sch Math & Phys Sci, Callaghan, NSW 2308, Australia
[5] UCL, Dept Phys & Astron, London WC1E 6BT, England
[6] Univ Rome Tre, Dipartimento Sci, I-00146 Rome, Italy
[7] Brandenburg Tech Univ Cottbus, D-03046 Cottbus, Germany
[8] UCL, Dept Elect & Elect Engn, London WC1E 7JE, England
基金
英国工程与自然科学研究理事会;
关键词
STM; barium; Ge(001); SCANNING-TUNNELING-MICROSCOPY; CRYSTALLINE OXIDES; ADSORPTION; SURFACE; PASSIVATION; INTERFACE; SILICON;
D O I
10.1088/0957-4484/26/15/155701
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
We use controlled annealing to tune the interfacial properties of a sub-monolayer and monolayer coverages of Ba atoms deposited on Ge(001), enabling the generation of either of two fundamentally distinct interfacial phases, as revealed by scanning tunneling microscopy. Firstly we identify the two key structural phases associated with this adsorption system, namely on-top adsorption and surface alloy formation, by performing a deposition and annealing experiment at a coverage low enough (similar to 0.15 ML) that isolated Ba-related features can be individually resolved. Subsequently we investigate the monolayer coverage case, of interest for passivation schemes of future Ge based devices, for which we find that the thermal evaporation of Ba onto a Ge(001) surface at room temperature results in on-top adsorption. This separation (lack of intermixing) between Ba and Ge layers is retained through successive annealing steps to temperatures of 470, 570, 670 and 770 K although a gradual ordering of the Ba layer is observed at 570 K and above, accompanied by a decrease in Ba layer density. Annealing above 770 K produces the 2D surface alloy phase accompanied by strain relief through monolayer height trench formation. An annealing temperature of 1070 K sees a further change in surface morphology but retention of the 2D surface alloy characteristic. These results are discussed in view of their possible implications for future semiconductor integrated circuit technology.
引用
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页数:8
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