Deformation-induced bonding of polymer films below the glass transition temperature

Bonding between polymers through interdiffusion of macromolecules is a well-known mechanism of polymer adhesion. A new polymer bonding mechanism in the solid state, taking place at ambient temperatures well below the glass transition value (T-g), has been recently reported; in this mechanism, bulk plastic compression of polymer films held in contact led to adhesion over timescales of the order of a fraction of a second. In this study, we prepared various blends of plasticized polymers films with desirable ductility from amorphous and semicrystalline powders of hydroxypropyl methylcellulose and polyvinyl alcohol derivatives; then, we observed the bonding of these polymers at ambient temperatures, up to 80 K below T-g, purely through mechanical deformation. The deformation-induced bonding of the polymer films studied in this work led to interfacial fracture toughnesses in the range of 1.0-21.0 J/m(2) when bulk plastic strains between 3% and 30% were imposed across the films. Scanning electron microscopy observation of the debonded interfaces also confirmed that bonding was caused by deformation-induced macromolecular mobilization and interpenetration. These results expand the range of applicability of sub-T-g, solid-state, deformation-induced bonding processes.