Surface-micromachined MEMS acoustic sensor with bottom electrode anchors

被引：1
作者：
Lee, J. [1 ]
Kim, H. J. [1 ]
Lee, S. Q. [1 ]
Lee, S. K. [1 ]
Ko, S. C. [1 ]
Park, K. H. [1 ]
机构：
[1] Elect & Telecommun Res Inst, IT Convergence & Component Lab, 161 Gajeong Dong, Taejon 305350, South Korea
来源：
ELECTRONICS LETTERS | 2008年 / 44卷 / 09期
关键词：
D O I：
10.1049/el:20080401
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A capacitive MEMS acoustic sensor with two sacrificial layers based on surface micromachining on a GaAs substrate is presented. This sensor has bottom electrode anchors fabricated using an initial sacrificial layer for the formation of a back chamber. The bottom anchors serve to eliminate the back side process of the wafer for a conventional back chamber because the chamber is implemented through substrate surface etching. The proposed circular-type microphone has a diameter of 1.0 mm and a gap height of 2 mu m. It shows a pull down voltage of 8.5 V and a total capacitance of 5.5 pF. Additionally, the MEMS microphone has a sensitivity of 0.09 mV/Pa at 1 kHz at a bias of 2 V.
引用
收藏
页码：576 / 577
页数：2
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