Thermal Properties of Silicon Nitride Beams Below One Kelvin

被引:10
作者
Wang, G. [1 ]
Yefremenko, V. [1 ]
Novosad, V. [1 ]
Datesman, A. [1 ]
Pearson, J. [1 ]
Divan, R. [2 ]
Chang, C. L. [3 ]
Bleem, L. [3 ]
Crites, A. T. [3 ]
Mehl, J. [3 ]
Natoli, T. [3 ]
McMahon, J. [4 ]
Sayre, J.
Ruhl, J. [5 ]
Meyer, S. S. [3 ]
Carlstrom, J. E. [3 ]
机构
[1] Argonne Natl Lab, Div Mat Sci, Argonne, IL 60439 USA
[2] Argonne Natl Lab, Ctr Nanoscale Mat, Argonne, IL 60439 USA
[3] Kavli Inst Cosmol Phys, Chicago, IL 60637 USA
[4] Univ Michigan, Dept Phys, Ann Arbor, MI 48109 USA
[5] Case Western Reserve Univ, Dept Phys, Cleveland, OH 44106 USA
关键词
Heat transport; phonons; superconducting transition edge sensor; thermal conductivity; HEAT; SCATTERING; CONDUCTIVITY; TEMPERATURES; TRANSPORT; SOLIDS;
D O I
10.1109/TASC.2010.2089407
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We have investigated thermal properties of 1 thick silicon nitride beams of different lateral dimensions. We measured the thermal conductance by simultaneously employing a TES both as a heater and as a sensor. Based upon these measurements, we calculate the thermal conductivity of the beams. We utilize a boundary limited phonon transport model and assume a temperature independent phonon mean free path. We find that the thermal conductivity is determined by the fraction of diffusive reflection at surface. The following results are obtained from 0.30 K to 0.55 K: the volume heat capacity is 0.082T + 0.502T(3) J/m(3) - K. The width dependent phonon mean free path is 6.58 mu m, 9.80 mu m and 11.55 mu m for 10 mu m, 20 mu m and 30 mu m beams respectively at a 29% surface diffusive reflection.
引用
收藏
页码:232 / 235
页数:4
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