Update on EUV radiometry at PTB

被引:10
|
作者
Laubis, Christian [1 ]
Barboutis, Annett [1 ]
Buchholz, Christian [1 ]
Fischer, Andreas [1 ]
Haase, Anton [1 ]
Knorr, Florian [1 ]
Mentzel, Heiko [1 ]
Puls, Jana [1 ]
Schoenstedt, Anja [1 ]
Sintschuk, Michael [1 ]
Soltwisch, Victor [1 ]
Stadelhoff, Christian [1 ]
Scholze, Frank [1 ]
机构
[1] Phys Tech Bundesanstalt, Abbestr 2-12, D-10587 Berlin, Germany
来源
EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY VII | 2016年 / 9776卷
关键词
EUV; at-wavelength; radiometry; metrology; reflectometry; exposure; METROLOGY;
D O I
10.1117/12.2218902
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
The development of technology infrastructure for EUV Lithography (EUVL) still requires higher levels of technology readiness in many fields. A large number of new materials will need to be introduced. For example, development of EUV compatible pellicles to adopt an approved method from optical lithography for EUVL needs completely new thin membranes which have not been available before. To support these developments, PTB with its decades of experience [1] in EUV metrology [2] provides a wide range of actinic and non actinic measurements at in-band EUV wavelengths as well as out of band. Two dedicated, complimentary EUV beamlines [3] are available for radiometric [4,5] characterizations benefiting from small divergence or from adjustable spot size respectively. The wavelength range covered reaches from below 1 nm to 45 nm [6] for the EUV beamlines [5] to longer wavelengths if in addition the VUV beamline is employed. The standard spot size is 1 mm by 1 mm with an option to go as low as 0.1 mm to 0.1 mm. A separate beamline offers an exposure setup. Exposure power levels of 20 W/cm(2) have been employed in the past, lower fluencies are available by attenuation or out of focus exposure. Owing to a differential pumping stage, the sample can be held under defined gas conditions during exposure. We present an updated overview on our instrumentation and analysis capabilities for EUV metrology and provide data for illustration.
引用
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页数:8
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