Kinetics of intermetallic compound layer growth and interfacial reactions between Sn-8Zn-5In solder and bare copper substrate

被引：21

作者：

Kim, DG ^{[1
]}

Jang, HS ^{[1
]}

Jung, SB ^{[1
]}

机构：

[1] Sungkyunkwan Univ, Dept Adv Mat Engn, Suwon 440746, South Korea

来源：

MATERIALS SCIENCE AND TECHNOLOGY | 2005年 / 21卷 / 03期

关键词：

Sn-Zn-In solder; interfacial reaction; intermetallic compounds; activation energy;

D O I：

10.1179/174328405X27061

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The growth kinetics of the intermetallic compound layer formed between Sn-8Zn-5ln solder and bare Cu substrate by solid-state isothermal aging were examined at temperatures between 70 and 150 degrees C for times up to 100 days. Experimental results showed that the intermetallic compound observed on the bare copper substrate was gamma-Cu5Zn8 and its thickness increased with ageing temperature and time. The layer growth of the intermetallic compound in the couple of the Cu/Zn satisfied the parabolic law at the given temperature range. As a whole, because the values of time exponent (n) were approximately 0.5, the layer growth of the intermetallic compound was considered to be mainly controlled by diffusion mechanism over the temperature range studied. The apparent activation energy for growth of the gamma-Cu5Zn8 intermetallic compound was 62 kJ mol(-1).

引用

页码：381 / 385

页数：5

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