Thermal design and analysis of multi-chip LED module with ceramic substrate

被引：86
|
作者：
Yin, Luqiao [1 ,2 ,3 ]
Yang, Lianqiao [3 ]
Yang, Weiqiao [3 ]
Guo, Yansheng [3 ]
Ma, Kejun [3 ]
Li, Shuzhi [3 ]
Zhang, Jianhua [1 ,2 ]
机构：
[1] Shanghai Univ, Sch Mechatron & Automat, Shanghai 200072, Peoples R China
[2] Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China
[3] Shanghai Univ, Shanghai Res Ctr Engn & Technol Semicond Lighting, Shanghai 200072, Peoples R China
来源：
SOLID-STATE ELECTRONICS | 2010年 / 54卷 / 12期
关键词：
AlN; Ceramic substrate; HP LED; Thermal dissipation; Multi chip; Thermal simulation; LIGHT-EMITTING-DIODES; HIGH-POWER; COEFFICIENT;
D O I：
10.1016/j.sse.2010.06.028
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper multi-chip LED modules with aluminum nitride (AlN) Al and aluminum oxide (Al2O3) based substrates were successfully designed fabricated and investigated Finite element method (FEM) and electrical test method were used to evaluate the thermal performance of LED modules Both simulation and experimental results show that the module with AlN based substrate exhibits better thermal performances than the two others Moreover AlN-based substrate LED module shows the best optical performances The optical performances of the LED modules with different substrates not only verify that the optical output and degradation of LED has a direct relation with the input current but also show that the degradation could begin earlier if the thermal dissipation is not managed well Crown Copyright (C) 2010 Published by Elsevier Ltd All rights reserved
引用
收藏
页码：1520 / 1524
页数：5
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