Microstructure-sensitive large-deformation model for thermomechanical processing simulations

被引:4
作者
Borkowski, L. [1 ]
Anahid, M. [1 ]
Staroselsky, A. [1 ]
Hu, W. [2 ]
机构
[1] Raytheon Technol Res Ctr, 411 Silver Lane, E Hartford, CT 06118 USA
[2] ANSYS LST, 7374 Positas Rd, Livermore, CA USA
关键词
Thermomechanical; Crystal plasticity; Aluminium alloy; Large deformation; Finite element; Shear band; Forging; SINGLE-CRYSTAL; CRYSTALLOGRAPHIC TEXTURE; DISLOCATION DENSITY; FATIGUE LIFE; PLASTICITY; EVOLUTION; FRACTURE; CREEP;
D O I
10.1016/j.ijsolstr.2021.111161
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
摘要
Current computational mechanics methods lack coupling between remeshing and microstructure-sensitive models. However, this combination is necessary to consider microstructural evolution during large-deformation, thermomechanical forming operations. A model focused on improving microstructure prediction under forming operations through the advancement of remeshing capabilities integrated with crystal plasticity finite element (CPFE) is developed. To enable coupling between remeshing and a large deformation crystal plasticity model, the current 3D adaptivity (i.e., remeshing) capabilities in LS-DYNA were enhanced to be compatible with a CPFE model. These enhancements include developing remapping techniques that properly account for crystallographic texture evolution during deformation. The tech-niques used for mapping of microstructure-related variables differ from the smooth interpolation schemes typically used for mapping of other field variables such as stress or displacement. It is demon-strated that combining the nonlinear large deformation capabilities of LS-DYNA, microstructure-sensitive remapping, and a CPFE model yields a simulation framework capable of accurately predicting evolution of location-specific forged part microstructures and shear band formation. Greater microstructural accu-racy in large-deformation models can lead to improved strength, life, and manufacturing yield of light-weight forged parts. (c) 2021 Elsevier Ltd. All rights reserved.
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页数:23
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