Effect of Temperature and Strain Rate on Dynamic Recrystallization of Inconel 617 during Hot Deformation

Thermostatic compression was performed using a Gleeble-3500 thermal simulation compressor in the temperature range of 900-1200 degrees C and strain rate range of 0.001-10 s(-1). Use the EBSD (Electron backscatter diffraction) analysis the effects of grain orientation and texture on the DRX of Inconel 617 alloy were analyzed, and the effects of the temperature and strain rate on the recrystallization of Inconel 617 alloy were deduced by the construction of a recrystallization model under these conditions. The results show that the grain orientation and texture are sensitive to the temperature and strain rate changes. Discontinuous dynamic recrystallization (DDRX) events of high-angle grain boundary migration result in nucleation and growth, and continuous dynamic recrystallization (CDRX) of high-angle grain boundaries occurs, due to the continuous rotation of subgrains. It was found that DRX occurred before the peak strain, and the ratio of the critical strain to the peak strain is lower than that generally obtained in previous work,due to the influence of twins.