High Deposition Rate Symmetric Magnet Pack for High Power Pulsed Magnetron Sputtering

被引:24
作者
Raman, Priya [1 ]
Shchelkanov, Ivan [1 ,2 ]
McLain, Jake [1 ]
Cheng, Matthew [1 ]
Ruzic, David [1 ]
Haehnlein, Ian [1 ,3 ]
Jurczyk, Brian [3 ]
Stubbers, Robert [3 ]
Armstrong, Sean [4 ]
机构
[1] Univ Illinois, Urbana, IL USA
[2] Natl Nucl Res Univ MEPhl, Moscow, Russia
[3] Staifire Ind, Chicago, IL USA
[4] Kurt J Lesker Co, Jefferson Hills, PA USA
关键词
HPPMS; HiPIMS; HiPIMS deposition rates; Magnetron sputtering; HiPIMS power supply; High deposition rate magnet pack for HPPMS; PHYSICS; FLUX;
D O I
10.1016/j.surfcoat.2015.12.071
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
High power pulsed magnetron sputtering is a promising physical vapor deposition technique with two minor challenges that obstruct its broader implementation in industry and its use by researchers. The first challenge is the availability of low cost HPPMS power supplies with output power under 2 kW. Such power supplies are suited for circular planar magnetrons with target diameters between 50 mm to 150 mm. The second challenge is the overall lower deposition rates of HPPMS when compared with direct current magnetron discharges. The "epsilon" magnet pack designed for a 100 mm sputter magnetron which was developed by the Center for Plasma Material Interactions at the University of Illinois at Urbana Champaign in collaboration with Kurt J. Lesker Company was capable of producing twice higher deposition rates in HPPMS compared to a conventional magnet pack. The cylindrically symmetric "TriPack" magnet pack presented here was developed based on magnetic field design solutions from the "epsilon" magnet pack in order to keep the high deposition rates, but improve deposition uniformity, without the need for substrate rotation. The new cylindrically symmetric magnet pack for 100 mm diameter targets, along with a specially designed cooling well provides stable operation at 2 kW average power, even with low-temperature melting-point target materials. The deposition rates from the TriPack magnet pack is compared with a commercial conventional magnet pack for DC and HPPMS power supplies. (C) 2015 Elsevier B.V. All rights reserved.
引用
收藏
页码:10 / 15
页数:6
相关论文
共 50 条
  • [1] High power pulsed magnetron sputtering: A method to increase deposition rate
    Raman, Priya
    Shchelkanov, Ivan A.
    McLain, Jake
    Ruzic, David N.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2015, 33 (03):
  • [2] Peak amplitude of target current determines deposition rate loss during high power pulsed magnetron sputtering
    Greczynski, G.
    Hultman, L.
    VACUUM, 2016, 124 : 1 - 4
  • [3] Deposition of yttria-stabilized zirconia thin films by high power impulse magnetron sputtering and pulsed magnetron sputtering
    Sonderby, Steffen
    Aijaz, Asim
    Helmersson, Ulf
    Sarakinos, Kostas
    Eklund, Per
    SURFACE & COATINGS TECHNOLOGY, 2014, 240 : 1 - 6
  • [4] The physical reason for the apparently low deposition rate during high-power pulsed magnetron sputtering
    Emmerlich, Jens
    Mraz, Stanislav
    Snyders, Rony
    Jiang, Kaiyun
    Schneider, Jochen M.
    VACUUM, 2008, 82 (08) : 867 - 870
  • [5] Deposition of rutile TiO2 films by pulsed and high power pulsed magnetron sputtering
    Schoenberger, W.
    Bartzsch, H.
    Schippel, S.
    Bachmann, T.
    SURFACE & COATINGS TECHNOLOGY, 2016, 293 : 16 - 20
  • [6] Pulse management in high power pulsed magnetron sputtering of niobium
    Hala, M.
    Capek, J.
    Zabeida, O.
    Klemberg-Sapieha, J. E.
    Martinu, L.
    SURFACE & COATINGS TECHNOLOGY, 2012, 206 (19-20) : 4186 - 4193
  • [7] High rate amorphous and crystalline silicon formation by pulsed DC magnetron sputtering deposition for photovoltaics
    Bailey, Louise R.
    Proudfoot, Gary
    Mackenzie, Brodie
    Andersen, Niels
    Karlsson, Arne
    Ulyashin, Alexander
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2015, 212 (01): : 42 - 46
  • [8] High power pulsed magnetron sputtering of transparent conducting oxides
    Sittinger, V.
    Ruske, F.
    Werner, W.
    Jacobs, C.
    Szyszka, B.
    Christie, D. J.
    THIN SOLID FILMS, 2008, 516 (17) : 5847 - 5859
  • [9] Chromium films deposition by hot target high power pulsed magnetron sputtering: Deposition conditions and film properties
    Grudinin, Vladislav A.
    Bleykher, Galina A.
    Sidelev, Dmitrii, V
    Krivobokov, Valery P.
    Bestetti, Massimiliano
    Vicenzo, Antonello
    Franz, Silvia
    SURFACE & COATINGS TECHNOLOGY, 2019, 375 : 352 - 362
  • [10] High power pulsed magnetron sputtering: A review on scientific and engineering state of the art
    Sarakinos, K.
    Alami, J.
    Konstantinidis, S.
    SURFACE & COATINGS TECHNOLOGY, 2010, 204 (11) : 1661 - 1684