Failure mechanisms and fault classes for CMOS-compatible microelectromechanical systems

被引：23

作者：

Castillejo, A ^{[1
]}

Veychard, D ^{[1
]}

Mir, S ^{[1
]}

Karam, JM ^{[1
]}

Courtois, B ^{[1
]}

机构：

[1] TIMA Lab, F-38031 Grenoble, France

来源：

INTERNATIONAL TEST CONFERENCE 1998, PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/TEST.1998.743197

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Silicon-compatible micromachining provides a foul cost monolithic solution for the integration of microelectromechanical systems (MEMS). In the lest years, CMP (the French MultiProject Wafer Service) has made available technological solutions for the fabrication of CMOS-compatible MEMS. Numerous monolithic devices have been fabricated wing this service. The inspection of failed devices has allowed the identification of the most typical failure mechanisms and design errors for this type of MEMS. This valuable information, together with a detailed analysis of the fabrication processes, is used in this paper to provide a classification of faults in silicon-compatible MEMS which can later be used for fault simulation and testing.

引用

页码：541 / 550

页数：10