A dry migration? Copper dendrite growth in adhesive tape during burn-in

被引：8

作者：

Tan, SH ^{[1
]}

Ong, SH ^{[1
]}

机构：

[1] Natl Semicond Mfg Singapore Pte Ltd, Failure Anal Lab, Singapore 319579, Singapore

来源：

PROCEEDINGS OF THE 2001 8TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS | 2001年

关键词：

D O I：

10.1109/IPFA.2001.941481

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Copper Migration which exhibits dendrites short-circuit in conductor-insulator-conductor structure may result in failure and reliability problem in microcircuits. Early works (1-6) have shown this mechanism in moist conditions. This is known as Wet Migration. In this investigation, we have observed Copper Dendrite Growth during burn-in stress in Adhesive Tape which was used for leadframes to maintain the co-planarity and stability of individual lead pins during the manufacturing of semiconductor. A special parallel lapping technique revealed the dendrite growth under the tape. It is believed that chemical interaction has taken place, especially due to polyamic acid which apparently reacts with copper. Further evaluations with higher temperature and voltage simulation confirm this mechanism.

引用

页码：178 / 182

页数：5

共 3 条

[1] MODELS FOR RELIABILITY GROWTH DURING BURN-IN - THEORY AND APPLICATIONS
FERTIG, KW
MURTHY, VK
PROCEEDINGS ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM, 1978, (NSYM): : 504 - 509
[2] Fractal description of dendrite growth during electrochemical migration
Dominkovics, Csaba
Harsanyi, Gabor
MICROELECTRONICS RELIABILITY, 2008, 48 (10) : 1628 - 1634
[3] Interactions and Self-Healing of Cu Vias During Stress Migration Tests and Implications for Burn-In and Design Rule Formulations
Hall, Gavin D. R.
Allman, Derryl D. J.
2017 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2017,

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