Void-induced cross slip of screw dislocations in fcc copper

被引：27

作者：

Hatano, Takahiro ^{[1
]}

Kaneko, Tetsuya ^{[2
]}

Abe, Yousuke ^{[2
]}

Matsui, Hideki ^{[2
]}

机构：

[1] Univ Tokyo, Earthquake Res Inst, Tokyo 1130032, Japan

[2] Tohoku Univ, Inst Mat Res, Sendai, Miyagi 9808577, Japan

来源：

PHYSICAL REVIEW B | 2008年 / 77卷 / 06期

关键词：

D O I：

10.1103/PhysRevB.77.064108

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Pinning interaction between a screw dislocation and a void in fcc copper is investigated by means of molecular dynamics simulation. A screw dislocation bows out to undergo depinning on the original glide plane at low temperatures, where the behavior of the depinning stress is consistent with that obtained by a continuum model. If the temperature is higher than 300 K, the motion of a screw dislocation is no longer restricted to a single glide plane due to cross slip on the void surface. Several depinning mechanisms that involve multiple glide planes are found. In particular, a depinning mechanism that produces an intrinsic prismatic loop is found. We show that these complex depinning mechanisms significantly increase the depinning stress.

引用

页数：6

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