Highly Anisotropic Thermal Conductivity of Three-Dimensional Printed Boron Nitride-Filled Thermoplastic Polyurethane Composites: Effects of Size, Orientation, Viscosity, and Voids

被引:47
作者
Guo, Haichang [1 ]
Niu, Hongyu [1 ]
Zhao, Haoyuan [2 ]
Kang, Lei [1 ]
Ren, Yanjuan [1 ]
Lv, Ruicong [1 ]
Ren, Liucheng [1 ]
Maqbool, Muhammad [1 ]
Bashir, Akbar [1 ]
Bai, Shulin [1 ]
机构
[1] Peking Univ, Sch Mat Sci & Engn, Ctr Appl Phys & Technol, Key Lab Polymer Chem & Phys Minist Educ, Beijing 100871, Peoples R China
[2] Univ Sci & Technol China, Natl Synchrotron Radiat Lab, Anhui Prov Engn Lab Adv Funct Polymer Film, CAS Key Lab Soft Matter Chem, Hefei 230026, Peoples R China
关键词
3D printing; boron nitride; thermal conductivity; orientation; size; POLYMER COMPOSITES; GRAPHENE; ALIGNMENT; MANAGEMENT; NANOSHEETS; PLATELETS; FILMS;
D O I
10.1021/acsami.1c23944
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Extrusion-based three-dimensional (3D) printing techniques usually exhibit anisotropic thermal, mechanical, and electric properties due to the shearing-induced alignment during extrusion. However, the transformation from the extrusion to stacking process is always neglected and its influence on the final properties remains ambiguous. In this work, we adopt two different sized boron nitride (BN) sheets, namely, small-sized BN (S-BN) and large-sized BN (L-BN), to explore their impact on the orientation degree, morphology, and final anisotropic thermal conductivity (TC) of thermoplastic polyurethane (TPU) composites by fused deposition modeling. The transformation from one-dimensional axial alignment in the extruded filament to two-dimensional alignment (horizontal and vertical alignment) in the stacking filament of BN sheets is observed, and its impact on anisotropic TC in three directions is clarified. It is found that L-BN/ TPU composites show a high TC of 6.45 W m(-1) K-1 at 60 wt % BN content along the printing direction, while at a lower content (<40 wt %), S-BN/TPU composites exhibit a higher TC than L-BN/TPU composites. Effects of orientation, viscosity, and voids are comprehensively considered to elucidate such differences. Finally, heat dissipation tests demonstrate the great potential of 3D printed BN/TPU composites to be used in thermal management applications.
引用
收藏
页码:14568 / 14578
页数:11
相关论文
共 59 条
  • [21] Facile and scalable fabrication of highly thermal conductive polyethylene/graphene nanocomposites by combining solid-state shear milling and FDM 3D-printing aligning methods
    Jing, Jingjing
    Chen, Yinghong
    Shi, Shaohong
    Yang, Lu
    Lambin, Philippe
    [J]. CHEMICAL ENGINEERING JOURNAL, 2020, 402
  • [22] Fundamentals and applications of 3D printing for novel materials
    Lee, Jian-Yuan
    An, Jia
    Chua, Chee Kai
    [J]. APPLIED MATERIALS TODAY, 2017, 7 : 120 - 133
  • [23] Magnesium-induced preparation of boron nitride nanotubes and their application in thermal interface materials
    Li, Chaowei
    Long, Xiaoyang
    E, Songfeng
    Zhang, Qichong
    Li, Taotao
    Wu, Jun
    Yao, Yagang
    [J]. NANOSCALE, 2019, 11 (24) : 11457 - 11463
  • [24] Experimental characterization of 3D printed PP/h-BN thermally conductive composites with highly oriented h-BN and the effects of filler size
    Li, Jiaqi
    Leng, Jie
    Jiang, Yixin
    Zhang, Jie
    [J]. COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2021, 150
  • [25] General, Vertical, Three-Dimensional Printing of Two-Dimensional Materials with Multiscale Alignment
    Liang, Zhiqiang
    Pei, Yong
    Chen, Chaoji
    Jiang, Bo
    Yao, Yonggang
    Xie, Hua
    Jiao, Miaolun
    Chen, Gegu
    Li, Tangyuan
    Yang, Bao
    Hu, Liangbing
    [J]. ACS NANO, 2019, 13 (11) : 12653 - 12661
  • [26] The Origin of the Sheet Size Predicament in Graphene Macroscopic Papers
    Lin, Jiahao
    Li, Peng
    Liu, Yingjun
    Wang, Ziqiu
    Wang, Ya
    Ming, Xin
    Gao, Chao
    Xu, Zhen
    [J]. ACS NANO, 2021, 15 (03) : 4824 - 4832
  • [27] Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation
    Lin, Ziyin
    Liu, Yan
    Raghavan, Sathyanarayanan
    Moon, Kyoung-sik
    Sitaraman, Suresh K.
    Wong, Ching-ping
    [J]. ACS APPLIED MATERIALS & INTERFACES, 2013, 5 (15) : 7633 - 7640
  • [28] High thermal conductive epoxy based composites fabricated by multi-material direct ink writing
    Liu, Junchao
    Guo, Yufeng
    Weng, Chuanxin
    Zhang, Hui
    Zhang, Zhong
    [J]. COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2020, 129
  • [29] Improved thermal conductivity of thermoplastic polyurethane via aligned boron nitride platelets assisted by 3D printing
    Liu, Junchao
    Li, Weiwei
    Guo, Yufeng
    Zhang, Hui
    Zhang, Zhong
    [J]. COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2019, 120 : 140 - 146
  • [30] Polymer composites with enhanced thermal conductivity via oriented boron nitride and alumina hybrid fillers assisted by 3-D printing
    Liu, Mengjing
    Chiang, Sun-Wai
    Chu, Xiaodong
    Li, Jia
    Gan, Lin
    He, Yanbing
    Li, Baohua
    Kang, Feiyu
    Du, Hongda
    [J]. CERAMICS INTERNATIONAL, 2020, 46 (13) : 20810 - 20818