Advanced packaging and substrate technology using conductive adhesives

被引：3

作者：

Eda, K ^{[1
]}

机构：

[1] Matsushita Elect Ind Co Ltd, Device Engn Dev Ctr, Osaka 5718501, Japan

来源：

3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/ADHES.1998.742017

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The packaging and substrate technology using conductive adhesives meets the trend of making electronic equipment smaller, lighter and less expensive with high performance. Flexible interconnection using conductive adhesives seems a key technology to relax the thermal stress among them in comparison with rigid interconnection such as soldering. In this paper, as the packaging and substrate technologies using conductive adhesives, stud bump bonding (SBB) and high density wiring board ALIVH (Any Layer Inner Via Hole) is discussed.

引用

页码：144 / 151

页数：8