Micromachined 60 GHz postsupported patch antenna with flip-chip interconnect

被引：1

作者：

Deng, Changjiang ^{[1
]}

Liu, Wendong ^{[1
]}

Hao, Qing ^{[1
]}

Feng, Zhenghe ^{[1
]}

机构：

[1] Tsinghua Univ, Dept Elect Engn, State Key Lab Microwave & Commun, Beijing 100084, Peoples R China

来源：

MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | 2015年 / 57卷 / 11期

基金：

中国国家自然科学基金;

关键词：

micromachining; 60; GHz; postsupported antenna; patch antenna;

D O I：

10.1002/mop.29418

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This letter presents the design of a micromachined patch antenna operating at 60-GHz band. The radiating patch and the feedline network are designed on the quartz glass (SiO2) and silicon (Si) substrate layers, respectively. An air gap, which is supported by four nonconductive posts and one solder ball, is added between the two substrate layers to reduce dielectric loss. The utilization of transparent quartz glass is helpful in alignment, and the feedline network is universal in patch array design. A 1 x 2 patch array is designed to verify the concept of array design. The measured -10 dB bandwidth of the proposed array is 2.7 GHz (56.5-59.2 GHz). (c) 2015 Wiley Periodicals, Inc. Microwave Opt Technol Lett 55:2706-2710, 2015

引用

页码：2706 / 2710

页数：5

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