Densification and properties investigation of W-Cu composites prepared by electroless-plating and activated sintering

W-20Cu composites were fabricated by electroless plating and low-temperature hot pressure sintering (850 degrees C) with different content of Ag particles range from 0 to 2.5 wt% as additives. The impacts of Ag additives on the densification and properties of W-Cu composites were investigated. X-ray diffraction and Field emission scanning electron microscope coupled with energy dispersive spectrum were used to analyze the phase and microstructure of powder and sintered composites. Relative density, electrical conductivity, Vickers hardness and bending strength were measured. W-20Cu composite powders prepared by electroless plating exhibited dense and uniform structure. The results showed that the addition of Ag had significant effect on the microstructure and properties of W-Cu composites, and the optimal content of Ag particles is 2 wt%. After added of 2 wt% Ag, the relative density of sintered W-Cu composites can achieved to 98.57%, the electrical conductivity reached 46.5% IACS, mechanical properties improved greatly due to the formation of solid solution during activated sintering, Vickers hardness and bending strength can reached 227.6 HV and 894.72 MPa, respectively.